| Microstructure behavior
in the tribological performance of abrasive manufacturing
processes for microelectronic devices |
We
seek to obtain an undergraduate researcher to perform
chemical mechanical polishing (CMP) experiments
of wafers fabricated by the PhD student. Additionally,
this student will assist the PhD student in performing
orientation imaging microscopy (OIM) to determine
the pre-process microstructural characteristics
(grain distribution) using MRSEC instrumentation.
Lastly, the student will conduct nano-mechanical
characterization tests on the pre- and post-CMP
wafers using a state-of-the-art nanoindenter located
in Prof. Higgs laboratory. |
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